Hot air BGA rework station
Three independent heating zones
The instrument control,8 sections of temperatures
Big flow constant current cools PCB
Detail Instruction
1. Intelligent heating, fan untrasfer,heating is not powered on.
2. Instrument control,and three independent heating zone,suitable for lead-free process.
3. The first heating zone, the second heating zone heater uses finely heating material,produces the high temperature breeze, the third heating zone uses the far infrared to send the hot plate preheating,prevents the PCB board curve.
4. 8 steps temperature control, that simulates the effect of reflow soldering machine. You can store 10 sets of temperature and time parameter.
5. After the heating finished used the great current capacity constant flow antithetical PCB board to carry on cooling,prevented the PCB board to curve,guarantee welding effect.
6. Hand-held vauum wand sucking BGA, convenient,reliable,durable.
7. Card board with a special tooling for a wide variety of notebook motherboard.
8. Hot air with a variety of dimensions,or according to special nozzle require custom.
RD280A PARAMETER TABLE
MODEL RD280A
Solder Type Normal Solder/Lead free
SMD ?BGA?BGA?CSP?QFP etc
PCB Thickness 0.5?4mm
PCB Size MAX 380mmW*400mmL
Heating/Consumption(Upper) Hot flow /800W
Heating/Consumption(Bottom) IR/3100W + Hot flow/800W
Steps 8steps
Bottom heating moves Z axis
YES
Positioning PCB Outer or jig
Driver Gear?rack
Moving Manual
Control Meter
Max Consumption 4.9KW
Power 220V OR 380V OR 110V
Dimension 600mmL X 550mmW X 600mmH
Weight 33Kg
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