FUNCTION PARAMETER
*. Two independent heating zones, multitude temperature zones control, lead free process.
*. Top heating zone use to infrared
*. The bottom zone applies to far infrared to pre-heating to prevent PCB curve.
*. Six-section temperature controls, simulates re-flower effect completely.
*. cools PCB after heating, to prevent PCB deflection.
*. BGA welding on completion of the demolition, a voice prompt
*. Vacuum wand sucks BGA, convenient, reliable and durable
*. Card board with a special tooling for a wide variety of notebook motherboard(option )
*. COM connection, connect with computer to achieve hi-end rework function.
MODEL RF7500
Solder Type Normal Solder/Lead free
SMD ?BGA、BGA、CSP、QFP
Thickness 0.5-4mm
PCB Size MAX 250mmW*200mmL
Heating/Consumption(Upper) IR /250W
Heating/Consumption(Bottom) IR/1200W
Control COM connection,PC connected
Max Consumption 1.5KW
Power 220V OR 380V OR 110V
Dimension 300mmL X 330mmW X 360mmH
Weight 14Kg
Packet Carton
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