Metal Material:
La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc, Y,
Ag, Al, Cu, Co, Zr, Cr, Ge, Hf, In, Ir, Mo, Ti , Ni, Ta, Nb, Se, Te, Re and so on.
Specifications of shaped materials:
Purity: 99%, 99.9%, 99.99%, 99.999% and 99.9999%.
Shape: foil, sheet, wire, filament, rod, pipe, tube, powder, pellet, shot, wafer, plate, tablet, ingot, chunk, lump, granule, dendritic, crystal, etc.
Sputtering Targets :Sputtering materials for the applications to magnetic disk and head, magneto optical disk, optical disk, superconducting thin film, protective film.
Metal Sputtering Targets or rare earth metal sputtering targets: Al, Ag, Au, La, Ce, Co,C, Cr, Cu, Dy, Er, Eu, Gd, Ho, Hf , In, Ir, Lu, Mg, Mn, Mo, Nb, Nd, Ni, Pr, Pd, Pt, Re,Sc, Si, Sm, Ta, Tb, Ti, Tm,V, W, Yb, Y, Zr ,
Alloy Sputtering Targets: AlAg , AlSi, CeGd, CeSm,CoZr, CoCr, CoNi, CoPt, CoNiCr,CoNiPt, FeCoB, CoTaZr, CoNbZr, CoCrMo, CrV, CrB, CrCu, DyFe, DyFeCo,GaAs , Gd-Fe, GdFeCo, NdDyFeCo, NiFe, NiTi, NiV, TbFe, TbFeCo, TbGdFeCo, TiAl, ZrTi, ZrNi , ZrNb, ZrAl, ZrCu, ZrY
Ceramic Sputtering Targets :Al2O3, Sb2O3, BaF2, Bi2O3, CaF 2, CdS, CeO2, CeF3 ,Cr2O3, GaAs ,Gd2O3 ,HfO2, ITO, Target PbZrO3, LaF3, MgF2, MgO, MoO, Nb2O5, Nd2O3, NdF3, NiO, Pr6O11, SiO, SiO2, SiC, Si3N4, Sm2O3, SrF3, Ta2O5, TiO ,TiO2 ,Ti2O3, Ti3O5, V2O5, WO3, Y
Sputtering Targets
Leadmat Advanced Materials Co.,Ltd is an experter in supplying sputtering targets. Leadmat can offers a full line of sputtering targets with various components from industrial grade to super high purity. Mostly targets are manufacture by programs. And leadmat can manufacture targets that are less and rare frequently used compositions.Leadmat can offer some addition server include substrade, bonding, backing plate.
Sputter Coating Application: Sputter coating thin film primary be used field include decorate thin film, construction glass, automobile widow, low radiation glass, plane display, optical communication/ optics field, light date store field, thin film solar cell, magnetism date store field.
Backing Plates and Bonding Service: Backing plates include OFHC copper, Aluminum, Titanium, Stainless steel or Molybdenum. The dimension will base on your drawing and you design.
Bonding Service
A?Back metallisation up to 1600 x 1000mm
B?Metallic and non-metallic bond coverage >98%
C?Ultrasonic c-scan on bond integrity
Sputtering Targets Shape and Size: Discs, Rectangle, Step, Plates, Sheets, Tube, Foils, Rods, Taper, Ring, S-Guns, Custom-Made.
Disk targets, column targets, step wafer targets (Dia<350mm, Thickness >1mm )
Rectangle Targets, Slice Targets, Step Rectangle Targets (Longth <1500mm, Witdh<300mm, Thickness>1mm)
Tube Target / Rotation sputtering Target (Outer Dia < 300mm, Thickness > 2mm)
Sputtering Targets Materials list:
A?Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), Dysprosium (Dy), Erbium (Er), Europium (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, Carbon, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), lanthanum (La), Lead (Pb), Lutetium (Lu), Manganee (Mn), Molybdenum (Mo), Magnesium (Mg),Neodymium (Nd), Niobiums (Nb), Nickel (Ni), Palladium (Pd),Platinum (Pt), Praseodymium (Pr),Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc),Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn)
B?Alloy Sputtering Targets:AlCu, AlCr,AlMg,AlSi,AlSiCu,AlAg,AlV,CaNiCrFe, CaNiCrFeMoMn, CeGd, CeSm, CrSi, CoCr,CoCrMo, CoFe, CoFeB ,CoNi, CoNiCr, CoPt,CoNbZr,CoTaZr, CoZr,CrV,CrB, CrSi, CrCu, CuCo, CuGa, CuIn, CuNi, CoNiPt, CuZr,DyFe, DyFeCo, FeB,FeC, FeMn, GdFe, GdFeCo, HfFe, IrMn, IrRe, InSn, MoSi, NiAl, NiCr, NiCrSi, NdDyFeCo, NiFe, NiMn, NiNbTi,NiTi,NiV,SmCo,AgCu, AgSn,TaAl,TbDyFe,TbFe,TbFeCo, TbGdFeCo, TiAl, TiNi, TiCr,WRe,WTi,WCu, ZrAl,ZrCu,ZrFe,ZrNb,ZrNi,ZrTi,ZrY,ZnAl,ZnMg
C?Ceramic Sputtering Targets
1?Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, Cr5B3, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, NbB2, TaB, TaB2, TiB2, W2B, WB, VB, VB2, ZrB2
2?Carbide Ceramic Sputtering Targets : B4C,Cr3C2,HfC,Mo2C,NbC,SiC,TaC, TiC, WC, W2C, VC, ZrC
3?Fluoride Ceramic Sputtering Targets : AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3, ReF3, SmF3, NaF, Cryolite, Na3AlF6 , SrF2, ThF4, YF3, YbF3
4?Nitrides Ceramic Sputtering Targets :AlN, BN,GaN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN
5?Oxide Ceramic Sputtering targets: Al2O3, Sb2O3, ATO ,BaTiO3, Bi2O3, CeO2, CuO, Cr2O3 ,Dy2O3 ,Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, ITO, Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu3Fe5O12, Lu2O3, MgO, MoO3, Nd2O3, Pr6O11, Pr(TiO2)2, Pr2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, ThO2, Tm2O3, TiO2, TiO, Ti3O5, Ti2O3, SnO2, SnO, WO3, V2O5, YAG, Y3Al5O12, Yb2O3, Y2O3, ZnO, ZnO:Al, ZrO2(unstabilized), ZrO2-5-15wt%CaO)
6?Selenides Ceramic Sputtering Targets: Bi2Se3, CdSe, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe
7?Silicides Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2
8?Sulfides Ceramic Sputtering Targets: CuS, Sb2S3, As2S3, CdS, FeS, PbS, MoS2, NbS1.75, TaS2, WS2, ZnS
D?Other: AZO,Cr-SiO,CIGS,ITO,IGZO, GaAs, Ga-P, In-Sb, InAs, InP, InSn, LSMO, Na3AlF6 ,YBCO, LCMO,YSZ
Evaporation Material
Leadmat Advanced Materails Co.,Ltd is an experter in the supplying coating material ,As a primary PVD coating material, Evaporation material are widely used for field of optical, electric, photoelectric, decorate and so on. Users usually make cold light mirror, high reflective coating, anti-reflective coating and laser coating etc.
The evaporation materials include Metal Evaporation Material , Oxide Evaporation Material , Fluorid Evaporation Material, Boride evaporation materials, Carbide evaporation mateirals, nitrides evaporation materials, selenides evaporation materials, sulfides evaporation materials, tellurides evaporation materials, Other Compound Evaporation Material, Mixture Evaporation Material , alloy evaporation material. Also Leadmat supply many kinds of evaporation process assistant tools (evaporation boots, evaporation crucible, evaporation sheet, evaporation source, filament...)
Specifications of shaped materials:
Purity: 99%, 99.9%, 99.99%, 99.999% and 99.9999%.
Shape: foil, sheet, wire, filament, powder, pellet, shot, tablet, ingot, chunk, lump, granule, dendritic, crystal, etc.
High Pure Materials
High Pure Materials Leadmat Advanced Materials Co.,Ltd provides its customers with materials of purities from 4N to 7N,such as metal pure materials?alloy pure materials and compound pure materials. As the absolutely necessary elemental materials of semiconductor industries, the products are applied to varieties of industrial fields, covering electroluminescence, thermoelectronics, electronics, infrared, information, solar energy generation and high performance alloy making, also Leadmat can offer a serious of three-four element semiconducttor etc.
Rare Earth Materials
China Leadmat Advanced Materials Co.,Ltd supply many kinds of rare earth product. It include high pure Rare Earth Metal, Rare Earth Oxide, Rare Earth Alloy ,Rare Earth Oxide, Rare Earth Fluoride, Rare Earth Chloride, Rare Earth Carbonate, Rare Earth Nitrate, Rare Earth Acetate and so on. Also we can offer many kinds of rare earth production,include Rare Earth Sputtering Targets, Rare Earth Evaporation Material, Rare Earth oxide Nano-powder, rare earth rod, rare earth foil, rare earth slab, rare earth disk, rare earth wire, rare earth trip, and some rare earth ceramic and crystal.
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